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Work Experience
ASIC Design Engineer Intern
NXP semiconductors•  January 2023 - April 2023
• Developed an Independent RTL module for the existing SOC IP module. • Worked with Clock Domain Crossing and Lint check on the existing IPs. • Inserted AUTOS in non-AUTO designs, for more straightforward modification of IP interconnect in future updates. • Worked on replacing the old flow MIDAS to CRR.
IoT Engineer Intern
Stanley Black and Decker•  June 2022 - August 2022
• Improved and resized the current schematic and the PCB design of the RDX (Rapid Data eXtractor) circuit to fit a smaller form factor • Built and verified a Battery saver circuit in current design for over-voltage protection • Assisted and collaborated with CAD designer to fit circuit design within DCE-040 housing • Coordinated with a cross-functional team of 10 to develop a product road of tools and devices with a USB-C charging option to DEWALT users in charging power platforms
Education
University of Cincinnati
Electrical Engineering, MS•  January 2021 - Present
GPA: 3.84/4.0
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